Indium Corporation’s Liyakathali Koorithodi, assistant technical manager, presented at IPC India on Sept. 24.
Koorithodi’s presentation, The Second Generation Shock Resistant and Thermally-Reliable Low-Ag SAC Solder with Mn, discussed SAC0510M, a solder alloy doped with Mn, and its considerable improvement in thermal fatigue performance and shock resistance.
Koorithodi has more than 13 years of experience in electronics assembly manufacturing. He has a diploma in mechanical engineering from the Department of Technical Education, Government of Kerala, and is an SMTA-certified process engineer. He earned his Six Sigma Green Belt from Motorola University.
The cornerstone of IPC India is a highly selective technical conference, featuring technical paper presentations that reveal new research innovations in the electronics industry. The event highlights presentations in the fields of design, printed boards, electronics assembly, and testing, and encourages interaction with the experts who are charting the course of tomorrow’s technology. The event was co-located with Electronica India and Productronica India.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
