Indium Corporation's Eric Bastow, assistant technical manager, will present at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif.
Bastow's presentation, Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?, explores the electrical reliability of two no-clean solder pastes stored under various conditions and aged over different time intervals.
No-clean solder paste technology is an attractive product in a competitive world. In this environment, every penny of assembly cost affects profitability. Therefore, it is important to implement a cost-effective process that renders the solder paste flux residue as benign and inert as possible to ensure electrical reliability. Bastow's presentation explores these issues. Additionally, he will reveal the results and any possible differences detected in SIR performances.
Bastow provides technical support for Indium Corporation's full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets. He is a certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH. Bastow is a certified IPC-A-600 and 610D specialist.
The IPC APEX Expo hosts thousands of colleagues from more than 50 countries at the industry's premier event and features advanced and emerging technologies in printed board design and manufacturing, electronics assembly, test, and printed electronics.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家「From One Engineer ToAnother®」（#FOETA）。
