Indium Corporation's Greg Wade, global technical support engineer, will share his expertise at the LaserJob Technology Forum on Nov. 6 in Furstenfeld, Germany.
Wade's presentation, How to Get the Absolute Most Out of Your Stencil Printing Process, discusses the latest techniques for creating a robust stencil printing process, including proactive maintenance, tooling do's and don'ts, stencil technology, and 3D statistical analysis.
Wade provides global technical support for Indium Corporation's multinational customers. He is an expert in surface mount and through-hole electronics assembly technologies and has more than 20 years of experience working with numerous electronics manufacturers and suppliers throughout the world. Wade is a veteran of the United States Navy and is educated in aviation RF electronics. He earned his Six Sigma Green Belt, is certified on numerous equipment sets, and holds several patents for tooling design.
The LaserJob Technology Forum brings together industry experts to focus on the circuit board of the future: smaller, smarter, and more complex. For more information about this event, visit LaserJob's website at www.laserjob.de.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
