Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise at the Surface Mount Technology Association International's (SMTAI)Power and High-Temperature Electronics Manufacturing Experience Sept. 30- Oct. 1 in Rosemont, Ill.
High-Pb solders are still used in a large number of electronics applications. However, legislation is driving the need for all industries to develop Pb-free solder alternatives that have a relatively high melting point. Jensen will present Pb-Free Alternatives for High Temperature Soldering on Sept. 30 at 11 a.m. His presentation will review this issue and present new alternatives for Pb-Free solders that are more responsibly priced, with a high melting point that can be easily processed using existing equipment. Examples of these options include BiAgX® solder paste and composite preform technology, which are user-friendly materials that can replace high-Pb alloys in many applications.
Jensen is an SMTA-certified process engineer. He earned his bachelor's degree in chemical engineering from Clarkson University. He has spent more than 15 years working with customers troubleshooting and optimizing SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Jensen is responsible for Indium Corporation's most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials.
SMTAi is an annual technical conference and exhibition on electronics assembly and advanced packaging that draws industry professionals from around the world. This year's event will also be the first to separately feature content dedicated to power electronics and high temperature. The "Power and High-Temperature Experience" aims to help engineers learn more about what is involved in this process, what new materials and challenges to expect, as well as basic assembly issues. For more information about the event, visit www.smta.org/smtai/HighTempExperience.cfm.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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