Indium Corporation’s Jacques Matteau, Global Sales Manager – NanoBond® and NanoFoil®, and Jim Hisert, PV Applications Engineer, will present at the Society of Vacuum Coaters (SVC) Technical Conference April 23-24 in Providence, R.I.
Matteau’s presentation, High-Temperature, Pb-free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil, will compare traditional Sn-based solders typically used in physical vapor deposition processes, specifically comparing shear strength, void analysis, and cross-sectional analysis.
Hisert will present: Eliminating the Bond Stress of Sputtering Targets at Operational Temperatures. This paper explores the possibility of setting the “zero stress point” at different temperatures to minimize stress during sputtering target assembly caused by thermal expansion mismatches and deflection during operation.
Matteau is responsible for market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the U.S. Matteau has over 20 years of experience with thin-film technologies and the electronics industry.
Hisert is responsible for supporting Indium Corporation’s materials for the photovoltaic industry. He readily shares his expertise by authoring technical papers, presenting at professional seminars, and participating actively in the IPC subcommittee, “Acceptance Criteria for Tabbing and Stringing.”
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
