Indium Corporation will share a variety of presentations on insightful topics ranging from artificial intelligence, the capabilities of gallium, advanced materials, and more, at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 30-Feb. 2, Kauai, Hawaii, U.S.
Monday, Jan. 30
- The Twin Paradox Explained by Senior Technologist Dr. Ronald Lasky
Tuesday, Jan. 31
- AI and Intelligent Transportation: Perception Versus Reality by Lasky
Wednesday, Feb. 1
- Experimental Analysis of the Effect of Void Area, Void Morphology, and Alloy Composition on the Total Thermal Resistance (Rth) of a Soldered Thermal Interface by Technical Support Engineer Ryan Mayberry
- Gallium: A Versatile Metal with Many Possible Applications by Lasky
Dr. Ronald Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s Founder’s Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.
Ryan Mayberry is a Technical Support Engineer based at Indium Corporation’s global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. Prior to joining Indium Corporation in 2021, Mayberry was an R&D scientist for a global metallization paste business, where he developed novel glass and paste metallization compositions tailored for emerging technologies. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About SMTA Pan Pacific Microelectronics Symposium
The Pan Pacific Microelectronics Symposium strives to build bridges and nurture relationships across all boundariesoceans and cultures, industries and technologies, companies and individuals. SMTA is an international association for electronics engineering and manufacturing professionals. SMTA offers exclusive access to local, regional, domestic, and global communities of experts, as well as accumulated research and training materials from thousands of companies dedicated to advancing the electronics industry.
