Indium Corporation is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region’s growing EV market.
“With our facility in Chennai, Indium Corporation is well positioned to support regional demand for consumer and infrastructure electronics, including EV manufacturing,” said Senior Country Sales Manager Damian Santhanasamy. “We look forward to serving the Indian electronics market, not only with our innovative materials, but by providing local technical support and expertise.”
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion suite of electrical, mechanical, and thermal solutions to reduce electric vehicle (EV) manufacturers’ time to market.
More than three million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion material solutions deliver reliability by:
- 消除非濕式開啟和頭枕式缺陷
- 符合更嚴格的表面絕緣電阻要求，防止樹枝狀生長
- 透過精確的接合線控制防止焊料脫層，並提高抗蠕變和抗疲勞能力
- 透過改善熱效率，減少熱點引起的空洞
Some of the featured Rel-ion products include:
- Award-winning Durafuse LT, a novel solder paste alloy technology with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
- The Indium8.9HF Solder Paste Series, an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- InFORMS, reinforced solder alloy fabrications, improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- Heat-Spring solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK.
To learn more about why over three million electric vehicles are on the road with Indium Corporation’s proven materials, visit them at productronica India stall #PB39 or at indium.com/relion.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
