Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a two-part workshop at SMT Hybrid Packaging 2015, May 5-7 in Nuremberg, Germany.
Dr. Lee’s workshop, DfX for Advanced Soldering Technology, covers the principles of designing for manufacturability (DfM) and reliability (DfR). Participants will learn how to maximize the output of manufacturing yield and reliability when addressing advanced soldering technology. Dr. Lee’s lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
SMT Hybrid Packaging is Europe’s leading event on system integration in microelectronics. The event offers a wide, international spectrum of exhibitors with the latest information on upcoming trends and developments.
Indium Corporation can also be found on the show floor at stand 7-100 and stand 7-331.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
