Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17.
Dr. Lee's presentation, Electromigration—The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity. Dr. Lee will also share recommendations on how to achieve extended life of solder joints and redistribution layers under high current-stressed conditions through optimized designs.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
SMTA webinars and webtorials provide opportunities to learn about the latest information on electronics assembly and advanced packaging without leaving the office. For information or to register, visit smta.org/education/presentations/presentations.cfm.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
