Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate two expert panels at International Conference for Electronics Enabling Technologies (ICEET) from June 5-7, in Markham, Ontario, Canada.
Sandy-Smith will moderate the Warpage Induced Defects and Component Warpage Limits panel. This panel features professionals from Plexus, Rockwell Collins, and Akrometrix.
Sandy-Smith will also moderate the Low-Melting Point Solder Pastes panel. Panelists will include Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, along with professionals from Alpha Assembly Solutions and Nihon Superior.
Sandy-Smith will also present Process and Materials Interaction Investigation: Or How to Measure Post-Process Assembly Surface Reliability.
Sandy-Smith is an industry leader renowned for her technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as Chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. She graduated from the International Engineering Program at the University of Rhode Island with a degree in chemical engineering and German language.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
