Indium Corporation’s Global Product Manager, Semiconductor and Advanced Assembly Materials, Dr. Andy Mackie, will be presenting at the Surface Mount Technology Association (SMTA) Intermountain Expo and Technical Forum, March 22, 2011 at Boise State University, Boise, ID.
Dr. Mackie’s presentation, "Theoretical and Practical Considerations for Optimizing PoP Assembly", will discuss both theoretical and practical considerations of the materials and processes used in package-on-package (PoP), and give assembly engineers tools for optimization.
Dr. Mackie has over 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow processes.
麥基博士因在焊膏工作組及組裝與接合材料分委員會的領導貢獻，於2001年榮獲IPC主席獎項。他接受過六西格瑪「實驗設計」的正式培訓，並在國際舞台發表論文及演講，研究主題涵蓋超臨界二氧化碳中的亞ppb金屬分析，乃至助焊劑殘留物的針探測試。 此外，麥基博士在新型聚合物、氣體分析及焊膏配方領域持有專利。
Dr. Mackie has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium’s global headquarters in Clinton, NY, USA. He is also the author of the Semiconductor / Power Semiconductor Assembly blog.
Indium Corporation will also be exhibiting at the event.
For more information or to register for the conference, visit the SMTA website.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
