Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program.
Live@Productronica benefits all participants, including Indium Corporation, its industry partners, and, most importantly, customers, through live product demonstrations on the show floor. These events provide attendees an accurate and honest depiction of material performance.
Live@Productronica 2019 partners include:
- Fuji Europe Corporation, Hall A3, Booth 317
- Häcker Automation, Hall B2, Booth 317
- Yamaha Motor Europe N.V. Branch Germany, Division IM, Hall A3, Booth, 323
Indium Corporation will feature the following products at partner booths as part of the Live@Productronica program:
- InFORMS®, reinforced solder preforms that help maintain the required bondline and promote good solder wetting.
- Core 230-RC, a no-spatter flux-cored wire specially developed to meet the demanding requirements of robotic and laser soldering.
- Indium3.2HF Solder Paste, an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
- Indium8.9HF Solder Paste, a no-clean, halogen-free solder paste designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
- TACFlux® 032-HF, a rework flux for Pb-free alloys in an air or inert gas reflow atmosphere, designed to provide excellent wetting in air or nitrogen atmospheres.
Indium Corporation’s products will also be used in internal customer demonstrations on the show floor.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
