Indium Corporation's Tim Jensen, senior product manager for engineered solders, will share his expertise during a Surface Mount Technology Association (SMTA) Webtorial on Oct. 15 and 23 from 1-2:30 p.m. EDT.
Jensen’s webtorial, Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies, provides practical knowledge on how to improve assembly processes to increase product reliability. Jensen will offer data and tools that can be used by process, quality, and design engineers to make effective and timely changes to their processes.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University and his MBA from Syracuse University. He has spent more than 15 years working with customers troubleshooting and optimizing SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials.
SMTA Webinars and Webtorials provide opportunities to learn about the latest information on electronics assembly and advanced packaging without leaving the office. For more information or to register, visit smta.org/education/presentations/presentations.cfm.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
