Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.
Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.
Karch 提供支援，包括分享製程知識，並針對 Indium Corporation 材料的使用提出技術建議，包括焊膏、預成型焊料、助焊剂和熱管理材料。Karch 擁有超過 20 年的汽車產業經驗，包括客製化電子產品的先進開發。他是 ECQA 認證的整合設計工程師，並擁有六標準差黃帶資格。奧地利專利局還將他選為 2014 年汽車 LED 組件十大 Inventum 獎得主之一。Karch 對製程技術和專案管理技能保持著深入的瞭解。
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
