Indium Corporation announces that Chris Nash has been promoted to Senior Technical Support Engineer. He is based at Indium’s global headquarters in Clinton, NY.
In his new role, Chris has expanded responsibilities for product support, in addition to providing comprehensive technical advice in the selection, use, and application of solder paste, flux, and solder alloy fabrications to customers in the electronics assembly, optoelectronic, semiconductor, and related industries.
Chris joined Indium Corporation in 2005 as an Account Coordinator for Inside Sales and most recently held the position of Technical Support Engineer. His area of expertise includes paste, preforms, InTEGRATED® preforms, flux-cored wire, rework materials, bar and wave solder, semiconductor materials, TIMs, and NanoFoil®.
Chris has a bachelor’s degree in Business Administration from Clarkson University, a Six Sigma Green-Belt from Dartmouth College, and is a Certified SMT Process Engineer (SMTA) and a Certified IPC-A-600 Specialist. Chris has authored numerous process and technical guidelines and has presented at several industry forums and conferences. He is a member of the SMTA and participates actively in the IPC standards development committee. He resides in Oriskany, NY.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
