Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, was recognized with two Distinguished Committee Service Awards from IPC at the IPC APEX Expo on Wednesday, Feb. 28 in San Diego, Calif.
The Distinguished Committee Service Awards recognized Sandy-Smith's contributions to the development of Amendment 1 to IPC J-STD-006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications, and her contributions to the 2017-2018 Technical Program Committee.
Brook Sandy-Smith is a Technical Support Engineer based at Indium Corporation's Global Headquarters in Clinton, NY and a leader in the industry for technical knowledge and support. Specializing in PCB assembly materials, she works closely with customers to develop custom solutions to optimize their processes. Sandy-Smith is an SMTA Certified Process Engineer and has a passion for developing and implementing standardized test methods. She is an active member of several IPC committees, SMTA programs, and iNEMI projects, and is currently serving as chair of the J-004 committee and Vice President of technical programs for the SMTA Empire chapter. Sandy-Smith graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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