Indium Corporation’s Tim Jensen, Product Manager – PCB Assembly Materials, will give a tutorial at SMTA International (SMTAi) on October 14, in Fort Worth, Texas.
Jensen’s tutorial, Soldering Technology for SMT: Achieving High Yields and Reliability, discusses solder materials, components, and PCBs to help attendees understand the importance of each in attaining an electronics product that meets current and future legislative restrictions. Additionally, a detailed discussion will include process optimization and defect elimination in the assembly process.
For more information about SMTA International, or to register for Jensen’s tutorial, visit www.smta.org/smtai.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
