圖書館
新聞稿
主題
類型
年份
Author
Indium Corporation Expert to Present at Delsys Tech Day
Indium Corporation‘s Andreas Karch, technologist advanced application and technical manager for Germany, Austria, and Switzerland, will present as part of Delsys Tech
Indium Corporation Expert to Present at iMAPS SiP Conference
Indium Corporations Strategic Advisor Dr. Dongkai Shangguan will share his technical insight and expertise on advanced packaging at the Advanced System in Package Technology Conference
Indium Corporation Experts to Present at ICEHET in Toronto
Indium Corporation experts Dr. HongWen Zhang, R&D manager alloy group, and Dr. Ronald Lasky, senior technologist, are set to deliver presentations at SMTAs
Indium Corporation President and COO, Ross Berntson, Inducted into MACNY Manufacturers Wall of Fame
Indium Corporation President and Chief Operating Officer, Ross Berntson, was inducted by the Manufacturers Association of Central New York (MACNY) into its Manufacturers Wall
Indium Corporation Expert to Present on EV at IPC Works Asia Webinar
Indium Corporations Leo Hu, senior area technical manager East China, will share his technical expertise and insight on electric vehicles (EV) during a webinar hosted by IPC China on
Indium Corporation, KATEK to Present Joint Process Development at SMTconnect
Indium Corporation expert Andreas Karch, regional technical manager and technologist advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at International Microwave Symposium
Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave
Indium Corporation Launches Rel-ion Technology for e-Mobility
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation is announcing a line of material solutions for e-Mobility.
Indium Corporation to Present at International Microwave Symposium
One of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products.
Solder Chemistry to Feature Solder Paste at SMTConnect
Solder Chemistry will feature two of its proven solder paste solutions at SMTConnect, May 10-12 in Nuremberg, Germany. Solder Chemistrys BLF083 is a lead-free, no-clean paste designed for
電動車專家將在可靠性網路研討會上分享技術心得
As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion Technical Webinars, Indium Corporation‘s EV experts are excited to announce the second
Indium Corporation Features High-Reliability Auto Products at SMTconnect
Indium Corporation will feature selections from its portfolio of high-reliability automotive solutions at SMTconnect, May 10-12 in Nuremberg, Germany. Indium Corporation has developed
Indium Corporation 在 TestConX 上展出用於燒錄和測試的金屬熱介質材料
Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 1-4 in Mesa, Ariz., U.S. As an industry leader in high-performance metal
Indium Corporation Experts to Present at PCIM e-Mobility Forum
Indium Corporation experts will share their technical insight and knowledge on automotive and electric vehicle (EV) materials solutions as part of an e-Mobility forum at PCIM Europe, May
Indium Corporations Dawn Roller 獲 YWCA Mohawk Valley 頒發獎項
Indium Corporation Associate Vice President of Human Resources, Dawn Roller, was honored by YWCA Mohawk Valley during its 33rd annual Salute to Outstanding
Indium Corporation Expert to Present at Electronic Components and Technology Conference
Indium Corporation Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal
Indium Corporation Expert to Present at SiP Conference China
Indium Corporations Leo Hu, senior area technical manager East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP
Indium Corporation 將於 ECTC 展出先進封裝的成熟產品
Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif., U.S.
Indium Corporations Dr. Ron Lasky to Present InSIDER Series Webinar on SMTA Certification
Indium Corporations Dr. Ron Lasky will share his insight on SMTA certification as part of the companys popular InSIDER Series of webinars. The presentation, Are You a
Indium Corporation to Present on e-Mobility at SMTA Michigan
Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at
