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Several Indium Corporation technology experts will present at IPC APEX March 25 – 27 in Las Vegas, Nevada. Dr. Ning-Cheng Lee, vice president of technology, will give two

Indium Corporation will feature its new technology platform using SACm™ solder paste at APEX March 25-27 in Las Vegas, Nevada. SACm™ is a high-reliability solder paste that increases the

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the regional SMTA expos in Plano and Stafford, Texas. On March 4, Dr. Lee will present Lead-free Solder

Indium Corporation announces a new solder paste technology. BiAgX® is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications.

Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste. Thomas is responsible for managing the company’s entire line of solder paste

Indium Corporation announces that Tim Jensen has been named the Senior Product Manager for Engineered Solders. Jensen is responsible for Indium Corporations most diverse product group, which includes

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present Properties and Applications of Low-Temperature Solders as part of a webinar sponsored by the SMTA on January

Indium Corporation announces the addition of two new employees: David Ryan as an environmental health and safety engineer and Paul Czajkowski as an environmental health and safety technician. Ryan is

Indium Corporation announces their latest Silver Quill Award winners. The winners are: Maria Durham, product support specialist semiconductor and advanced assembly materials; Christopher Nash,

Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indiums unique halogen-free oxidation barrier technology with optimized

Indium Corporation, Kyzen, and DEK hosted a technical seminar on November 27, 2013 in Manila, Philippines. The seminar, titled Soldering, Cleaning & Machine Efficiency, featured presentations by

Indium Corporation’s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.

Indium Corporation is pleased to announce that Jeff Anweiler has been named business development manager for precious metals products and Leo Devine has been named regional sales manager for the

Indium Corporation is pleased to announce that Pony Liao, area technical manager Northern China, has earned his Six Sigma Black Belt certification through the American Society for Quality. Liao joins

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SMTA certification is one of the electronics assembly industry’s most respected elements of process excellence. 2014 marks the 10th anniversary of the SMTA certification program, as well as the

Indium Corporation announces that Jeff Johnson has joined Indium Corporation as a Product Development Engineer. Johnson is based at Indium Corporation’s global headquarters in Clinton, N.Y.

Die Indium Corporation wurde am 12. November auf der Productronica in München mit dem Global Technology Award für ihre SACm-Lotlegierung ausgezeichnet. Verliehen von der Zeitschrift Global

Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability

Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13 – 14 in Costa Mesa, California. Dr. Ning-Cheng Lee, Vice

Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang,