Posted On: April 26th, 2016 | By: Christopher Nash

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design

Learn about the many factors associated with BTC voiding reduction. ...

Posted On: April 19th, 2016 | By: Phil Zarrow

Nano-Ag Sintering Paste

Learn what porosity and pressure mean to silver sintering materials in electronics assembly. ...

Posted On: April 19th, 2016 | By: Phil Zarrow

Voiding in Electronics Assemblies: Causes & Mitigation

Learn how to reduce voiding in electronics assemblies through the use of proper process and materials. ...

Posted On: April 12th, 2016 | By: Dr. Ron Lasky

Using Solder Preforms to Reduce Voiding in BTCs

Voiding underneath BTCs is greatly reduced using a novel process technique from the Indium Corporation....

Posted On: April 4th, 2016 | By: Phil Zarrow & Dr. Andy Mackie

Voiding in Die-Attach Electronics Assembly

This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...

Posted On: April 4th, 2016 | By: Phil Zarrow & Dr. Andy Mackie

Causes and Solutions to Voiding in Die-Attach

This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...

Posted On: March 23rd, 2016 | By: Dr. Ron Lasky

To Minimize BTC Voiding, Start with the Right Solder Paste

Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six S...

Posted On: March 21st, 2016 | By: Ross Berntson

Avoid the Void®

Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution.&nbs...

Posted On: March 18th, 2016 | By: Indium Corporation®

Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®

For process engineers hoping to reduce voiding in electronics assembly, watch as I discuss the reliability of Indium10.1 and Indium8.9HF and how they ...