AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
Avoid the Void
AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: PWB Design
Learn about the many factors associated with BTC voiding reduction. ...
Nano-Ag Sintering Paste
Learn what porosity and pressure mean to silver sintering materials in electronics assembly. ...
Voiding in Electronics Assemblies: Causes & Mitigation
Learn how to reduce voiding in electronics assemblies through the use of proper process and materials. ...
Using Solder Preforms to Reduce Voiding in BTCs
Voiding underneath BTCs is greatly reduced using a novel process technique from the Indium Corporation....
Voiding in Die-Attach Electronics Assembly
This video is for people who are trying to select or develop the proper reflow profile for a die-attach process. It will tell you the differences betw...
Causes and Solutions to Voiding in Die-Attach
This video is for engineers challenged by voiding in die-attach electronics assembly applications. It covers causes and methods to Avoid the Void®...
To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six S...
Avoid the Void®
Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution.&nbs...
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®
For process engineers hoping to reduce voiding in electronics assembly, watch as I discuss the reliability of Indium10.1 and Indium8.9HF and how they ...
Avoid the Void® Using Heat-Spring Metal Thermal Interface Materials
Watch as I discuss voiding in thermal management and how you can Avoid the Void®....
Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....