Avoid the Void®: Voiding in High-Temperature Soldering
Gold-tin eutectic solder can be used as the second-step solder, after the initial die-attach step. ...
Avoid the Void
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Voiding is a major problem in electronics assembly, especially in high-temp applications ...
Interview with Sze Pei Lim at Productronica China 2017
Interview with Sze Pei Lim at Productronica China 2017. ...
Indium8.9HF Solder Paste: Material Comparisons for Soldering Process Issues
Material Comparisons for Soldering Process Issues. ...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding Results
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
How Process Variables Affect Variation in QFN Voiding
Indium Corporation's been doing extensive testing on the effect of different process variables on voiding and QFNs... ...
PanPac is a great opportunity to learn more about new technologies!
Indium Corporation is presenting 3 papers at the SMTA PanPac in February. Learn more....
Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)
This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the Void®......
Process Considerations for QFN Voiding in SMT Electronics Assembly (2/3)
This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of Avoid the Void®......
Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)
This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void®......
Avoid the Void® Common Causes of Voiding in Electronics Assembly
This video is for anyone interested in the causes and effects of voiding in solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, voidin...