Thermocompression Bonding for Microbump Flip-Chip Soldering
For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D jo...
For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D jo...
Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that......
Folks, HIS iSuppli performed a teardown analysis of an iPad . They estimate that the cost of the bill of materials (BOM) is $336....
Folks, Back in October, I posted comments on lead-free reliability. In this post, I mentioned that I chaired a session at SMTAI on “...
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materia...
Folks, I was at SMTAI (Surface Mount Technology Association International) from September 24 and 27, 2010. As I mentioned, I cha...
Solder paste is made to be reflowed in the SMT process. Exactly HOW that is done is critical to your success. Included in the Product Data Shee...
Patty, Rob, and The Professor finished their tasks in Shenzen and were flying to Shanghai for their last set of challenges in electronics assembly.&nb...
Folks, After my recent post on the fact that there was no data linking tin whiskers to the Toyota sudden acceleration issues, there continue to be m...
Folks, A reader commented that he liked the Patty and The Professor stories for their technical content, but he felt there was “too much story.&...