A Day in the Life of a Tech Guy
7:40am Just got in, fired up the laptop, and made some hot chocolate. This is the best time to get a......
Air or Nitrogen Atmosphere for BGA Rework
This is one the best BGA rework tutorials I’ve seen so far. I’m a sucker for video tutorials and these videos do a pretty good job o...
Anxiously Awaiting TMV™ (Through Mold Via) PoP Dummy Components
Source: Amkor The new TVM™ PoP components......
Next Generation PoP Paste Presentation at SMTAI 2009
3 weeks ago I had the chance to present at the SMTAI event in San Jose. This venue not only had pleasant weather, it had top level engineers...
Mixed Alloy Wetting for SAC BGA Assembly Using Sn63 Solder Paste
Have you ever wondered about what happens to a Pb-free Ball-Grid Array (BGA), with Tin/Silver/Copper (SAC) spheres in a Tin/Lead (Sn/Pb) proces...
Solder Alloy Powder Misconceptions
For a change of pace, again, I have asked another Technical Support Engineer, Chris Nash, to comment about powder sizes. Chris is the Regional T...
Say Hello to the New Halogen-Free No-Clean Ball Attach Flux
Following the success of NC-506 (No-Clean flux for mounting spheres on BGA packages) is a halogen-free version – NC-585.span......
Solder Paste Dipping for PoP and Rework
What’s the difference between Package-on-Package (PoP) / BGA rework solder paste, and solder paste designed for SMT? ......
The Future of BGA Assembly
What is in store for us 5 or 10 years from now? My best guess is that new substrate......