Calculating Confidence Intervals of Cpk in Stencil Printing
In stencil printing, the basic foundation is transfer efficiency. About two-thirds of all end-of-line defects can be traced back to the stencil printi...
Exploring the Wet Gold Technique to Measure Precious Metal Content
What is the wet gold technique? How does it work? ...
Intermetallic Growth Rate is Strongly Temperature Dependent
I discuss that, though IMCs are not that brittle, it is wise to limit their growth....
Intermetallics and Kirkendall Voids Continue to Grow at Room Temperature
Kirkendall voids form when one metal diffuses more rapidly into another metal than vice versa....
Intermetallics: The Miracle of Soldering
New research suggests that solder joint failure modes are in the interfaces between the intermetallics and the solder, copper, or the intermetallic co...
Using C Charts for Different Sized Data Sets
C Charts are control charts used to track attribute data. Learn more here....
Is the Robot Apocalypse Upon Us?
Recall that quite a few horse manure shovelers were displace by the introduction of the automobile, and that numerous wood choppers had to retool with...
Will Robots Soon Take Jobs Away?
Some say fully autonomous vehicles will not arrive until 2045 at the earliest. Let's explore....
Cpk is Still King in Evaluating an SMT Solder Paste Printing Process
To evaluate an SMT stencil printing process you want to know its precision and accuracy. ...
SMT Stencil Design: Formula for Area Ratio of Elongated D
Learn how to calculate the area ratio of an elongated D stencil aperture....