The 6 Alloy Families: Indium - Part 1
We explore indium metal and alloys. The discussion covers physical properties (melting point, coefficient of thermal expansion, thermal conductivity, ...
We explore indium metal and alloys. The discussion covers physical properties (melting point, coefficient of thermal expansion, thermal conductivity, ...
Eric Bastow discusses tin (Sn) as a key ingredient of solder alloys. He includes physical properties, performance, and applications. ...
Eric Bastow continues his discussion of indium metal and alloys as solders against gold (Au) metallizations. The discussion emphasizes applications (e...
Eric Bastow discusses the physical properties and applications of lead as a solder ingredient. ...
Electronics manufacturers who have considered implementing nitrogen in their soldering process know the largest obstacle is cost. Let's explore....
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....
Non-Wet Opens (NWO): Understand the cause as well as the necessary flux technology to mitigate them....
The title of this blog is a little misleading because it is actually going to focus on an inappropriate method that is sometimes used in wav...
There is a lot of interest in plating indium bumps and other fine features onto wafers and other substrates. And the desired bump size and pitch ...
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliab...
Round solder wire, especially flux-cored, has been a mainstay of the electronics industry ever since electronics came into existence. Round solde...
The telecom industry relies heavily on Telcordia (Bellcore) testing to determine the electrical reliability of no-clean solder flux residues. There ar...