Package-on-Package Spacers
I’m going to let the PoP Interconnect Spacers data sheet do the technical explanation here, but I’ve gotta say these spacers have quite a ...
I’m going to let the PoP Interconnect Spacers data sheet do the technical explanation here, but I’ve gotta say these spacers have quite a ...
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on th...
Package-on-Package processing steps can create delays in getting to the reflow process. If you are new to stacking components, consider the mainstream...
Folks, There has recently been concern over the raising price of commodities (e.g.: copper, tin, silver, gold, cement, steel, oil, lumber, etc). So it...
Folks, As I said in a recent posting, the Packaging Directive has been around for 12 years so I didn’t expect many problems with the packaging t...
Folks, I have had a number of questions about Packaging Materials (i.e. the box the electronics comes in) being covered under RoHS. Packaging material...
Folks: A reader writes: Dr. Ron I attended your seminars last year at the SMTAI Technical Conference in Chicago and Boston and discussed with you LF i...
Folks, Recent work and teaching has caused me to reflect on several interesting properties of alloys. Alloying typically: 1. Lowers the melting temper...