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I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from wor...
I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from wor...
I’d say my version of the term is ‘protecting a semiconductor while facilitating its connection to the outside world’. Here’s ...
Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But......
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
Simply stated, YES. In effort to stay on top of industry technology I spend as much time as I can afford attempting to learn about the current thermal...
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
Even if you only x-section every now and then, it is easy to develop bad habits. Here are some quick tips to help the novice x-section preparer: 1) Po...
E-mail is easy, and helps clarify requests and information, however talking directly with a Technical Support Engineer or Application Engineer allows ...