Die Attach Paste Alternative
We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This...
Indium Corporation®'s Blog
Flip Chip Flux vs. Wine
Flip chip fluxes are like wine in a couple ways, and very different in others… 1) Flip chip fluxes and wines are carefully manufactured and te...
Many shades of “Green”
Last week I was asked “Is this flux green?” – regarding one of our leading ball attach fluxes. My first reaction was – ...
Non-Contact Measurement
I recently had a chance to work with Fries Research & Technology (FRT) to measure deposited material volumes and shapes. The guys from FRT were k...
Overpower Your Competitors
Drag racing can be compared to launching your new product: You need performance parts to get your project moving – and in the same way, we like...
Sphere Quality
Have you ever been so proud of something that you just wanted to go yell out your feelings from a rooftop? Here’s the deal – our spheres ...
Demand Semiconductor-Grade Flux
Speaking as a guy who knows flux – they are not all created equal. Flux use spans many industries, some of which can get away with crude ingred...
Seek Professional Help
At Indium we pride ourselves on Technical Service. If you’re seeing something out of the normal with your soldering materials – please gi...
Air-Free Flux Advantages for Flip Chip Dipping
De-gassing a flux changes its properties so much that we can’t sell it as the same flux anymore! Beyond eliminating air bubbles, the main thing...
“There’s an ‘L’ in solder?”
This question was posed to me while introducing a family member to the world of Engineered Solders this past weekend. While I was still reeling from t...
Die-attach Stresses
Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor d...
The Thermal Team on Tour
Can’t get enough of us? Members of Indium’s thermal management team will be attending MEPTEC’s 4th Annual Thermal Management symposi...