Day 1 of the Device Packaging Conference
Today I was able to attend a professional development course related to Package-on-Package technology and trends. While the session was very informat...
Today I was able to attend a professional development course related to Package-on-Package technology and trends. While the session was very informat...
An article I just read caught my attention (To see the article which stimulated this entry, click here.). It outlined the need for reliability in cons...
Please don’t be fooled by misconceptions like the following: 1) Lead is bad 2) Soldering is simple 3) Soldering is complex 4) Changing a S...
Many applications, primarily those for burn-in, require that a single thermal interface material survive multiple insertions. In response to this dema...
How can we be so sure our thermal interface materials will work for you? We model them of course! Our thermal lab includes the capability of......
In a perfect world, materials printed through a circular stencil aperture would be column-like with a flat top. When you look closely at a printed fl...
Why doesn’t my solder flow? The most common issue preventing good solder wetting on a substrate is oxidation. All metals are prone to some level...
Getting a new project can be like being lead down a dark path. Every day I talk to engineers who must have just left their bosses office with the wei...
The IMAPS Device Packaging Conference is quickly approaching, it’s less than a week away! If I had to pick one conference to go to per year, it...
Here is some data to compare the relative spread of indium based alloys on copper. Notice the difference between the old and new lots of 90In/10Ag. ...
In our technical service department, we are not allowed to see the pricing of our products. This may seem strange at first – but it allows us t...
We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This...