Next week (2-7 June) is the International Microwave Symposium in Boston, MA. If you’re involved in RF/ microwave technologies and 5G infrastructure, you will not want to miss this event.
Indium Corporation will be there, promoting our low-voiding solder preform technologies that come in a variety of temperature ranges. This is one of our biggest shows in the Northeast USA focused on RF and 5G infrastructure, and we look forward to connecting with customers, networking with others in our industry, and learning about new applications within this exciting and fast-growing market.
Please stop by and ask us about our Quick Turn Program for new AuSn preform designs for die-attach applications.
Drop by booth #691 to see us or contact me to set up an appointment at the show. I look forward to seeing you and learning about your projects.