Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....
If you are new to Package-on-Package solder paste, expect the material to be lower viscosity then you are used to for printing or even dispensing appl...
It’s always good to be cautious when dealing with high-reliability devices. No-clean ball attach and package-on-package fluxes are usually desig...
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...
Package-on-Package processing steps can create delays in getting to the reflow process. If you are new to stacking components, consider the mainstream...