PCIM 2018 Preview
Seth Homer, Product Manager Engineered Solders, talks Indium Corporation's InFORMS® and LV1000 flux coating, which are being featured at ...
InFORM
InFORMS®: A Drop-In Solder Replacement
Seth Homer, Product Manager Engineer Solders, and Phil Zarrow discuss Indium Corporation’s InFORMS® preforms and patent-pending ribbon ...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding Results
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding DOE
This is the fourth in a series of posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Today's focus is v...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Quantifiable Bondline Consistency
This is the third in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Quantifiable bondl...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Technology Advancement
This is the second in a series of blog posts discussing reinforced solder preforms for high–reliability and low voiding....
Introduction Natural Limitations of Solder Joint Performance in High-Power Applications
InFORMS® can help you reduce voiding, improve reliability, and enhance solder performance in high-power applications....
PanPac is a great opportunity to learn more about new technologies!
Indium Corporation is presenting 3 papers at the SMTA PanPac in February. Learn more....
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
As we discussed in part I of this three-part series, uneven solder bondline thickness between the substrate and baseplate of an IGBT module can cause ...