Driving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages....
SiP
Indium3.2HF Solder Paste for SIP Assembly
SIP assemblers pack more electronic components into a tiny space. Components, and the gap between components, is getting smaller. ...
SiP Materials (System-in-Package) VIDEO
There exists a wide range of assembly products for the SiP process, especially solder pastes....