Indium Corporation announces the company’s Silver Quill Award winners for 2010.
Mike Fenner, Technical Projects Manager, European Operations, Dr. Andy Mackie, Global Product Manager, Semiconductor and Advanced Assembly Materials, and Graham Wilson, Applications Engineer, authored the award winning paper, "New Developments in High Performance Solder Products for Power Die Assemblies". This paper was written for and presented at IMAPS 2010 in Raleigh, North Carolina.
Ed Briggs, Technical Support Engineer and Dr. Ronald Lasky, Senior Technologist, were presented with the Silver Quill’s Impact on the Industry award. Their paper, "Process Optimization to Prevent the Graping Effect", was written for and presented at SMTA’s International Conference on Soldering and Reliability, in Toronto, Canada.
Copies of the papers are available for download on Indium Corporation’s website.
Indium’s Silver Quill Award was developed to encourage individuals to author technical reports, presentations, articles, and books and to honor the most effective works. Points are awarded for the quality and quantity of the work and for the region and market the work addresses.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの化学薬品および調達、Reactive NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
