Indium Corporation’s Joe Bahou, Technical Sales Support Engineer, West Coast, will present at SMTA San Diego’s Chapter Meeting on March 8 in Poway, Calif.
Bahou will present Minimizing Voiding in Bottom Terminating Components, which provides an introduction to QFN challenges, determining void criteria, design of experiments (DOE), results, void control using Solder Fortification®, and conclusions.
Bahou supports Indium Corporation’s advanced SMT materials, fluxes and engineered thermal materials to customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Bahou is based in Huntington Beach, Calif., and has more than 16 years of experience in electronics assembly manufacturing, including hands-on experience in SMT production. Bahou has a bachelor's degree in mechanical engineering from the University of Massachusetts Lowell. In addition, he has worked on the development of 01005 chip component placement onto a printed circuit board.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、および熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
