Indium Corporations Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation on interconnect reliability at the IEEE Symposium on Reliability for Electronics and Photonics Packaging (IEEE REPP) in a hybrid event on Nov. 9-10, Santa Clara, Calif., US., and online.
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical.
The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions, etc. Cu direct bonding, without solder, presents new considerations in interconnect reliability.
At the same time, as electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from mechanical and thermomechanical to electrical and electrochemical. These considerations will impact reliability engineering for semiconductor devices, from design for reliability to accelerated testing and analysis. Yet another important dimension for interconnect reliability involves sustainability of electronic products, which demands environmentally friendly materials and processes, such as no-clean soldering, lead-free soldering, low-temperature soldering, etc.
Understanding of the failure mechanisms for different interconnect materials is of great importance to interconnect reliability and, ultimately, reliability of semiconductor devices and electronic systems.
Dr. Shangguan is a strategic advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industrys most prestigious awards, including IPCs Presidents Award, the Society of Manufacturing Engineers (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelors degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books and more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 28 U.S. patents and several foreign patents.
インジウム・コーポレーションについて
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家であるFrom One Engineer To Another (#FOETA)を、www.linkedin.com/company/indium-corporation/または@IndiumCorp でフォローすることもできます。
About IEEE REPP
This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
