Indium Corporation Northeast Technical Support Engineer Amanda Hartnett will present her technical findings at IMAPS NE 39th Symposium & Expo on May 8, 2012, in Boxborough, Mass.
Amanda’s presentation, Applications for Soft Metal Alloy TIMs for Flangeless RF Power Amplifier Package Mounting, will identify thermal, mechanical, and assembly benefits seen with the application of these soft metal alloy thermal interface materials (SMA TIM) for high-power RF devices.
Amanda will also present A Comparison of Eutectic AuSn Alloy Delivery Options and Assembly Processes for LED Die-Attachment. This paper compares die-attachment methods using various forms of AuSn solder, including solder preforms, solder paste, and pre-deposits of plated AuSn that were placed/dispensed and reflowed using Palomar Technologies’ die bonder and a Pulse Heat System (PHS). These methods and materials find relevance in die-attachment of high-power, high-brightness LEDs.
Amanda provides advice on thermal design issues in many different industries, including communications, military, and photonics. Amanda specializes in coaching manufacturing, process, and design engineers on their choice and application of solder interface materials and other bonding materials to achieve reliable and high-performance thermal attachment solutions.
Amanda has presented at industry technical seminars and authored technical papers on thermal management and microelectronics packaging materials. She is active in several industry organizations including SPIE and IMAPS, as well as industry-leading DARPA projects.
Amanda has a bachelor’s degree in chemistry from Utica College and is completing her graduate degree at the State University of New York Institute of Technology. Amanda is based at Indium Corporation’s global headquarters in Clinton, NY. She also authors a technology blog, which can be found at blogs.indium.com/blog/amanda-hartnett.
For more information on the IMAPS NE 39th Symposium & Expo, visit www.imapsne.org.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜および熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの金属および化合物、Reactive NanoFoil®などがあります。1934年に設立されたインジウム・コーポレーションは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
