プレスリリース

Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S. Indium Corporation offers a robust

Indium Corporations Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiatives virtual Packaging Tech Topic

Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at

Indium Corporation‘s Evan Griffith, product specialist, will share his technical knowledge and insight on the evolution of solder paste for semiconductor applications at

The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporations Dr. HongWen

Indium Corporations Brian OLeary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at

Indium Corporation has immediate openings for Production Operators and other positions at its Rome and Clinton facilities and is offering prospective employees the opportunity for immediate

Indium Corporation has earned a Visionary Partnership Award from NSW Automation for the development of its innovative Indium12.8HF Solder Paste following an appreciation

Indium Corporations innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface Mount

Indium Corporation is pleased to announce several personnel updates at the companys facility located on Robinson Road in Clinton, New York.  Kay Parker has accepted a new role as a

Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004 (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the

Durafuse, Indium Corporations award-winning mixed-alloy technology, will be the focus of a virtual presentation by Dr. HongWen Zhang for the Institution of Engineers,

The next offering in Indium Corporation‘s acclaimed InSIDER Series of webinars will be a discussion on the challenges with high-reliability power electronics assemblies and an

Indium Corporation will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 25-27, San Diego, Calif., U.S. Live@APEX is a collaboration between

Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy291 wave solder pots designed to maintain recommended solder pot specifications.  The supplemental

Indium Corporations Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics

Indium Corporation is pleased to announce two personnel updates within its marketing team operating out of the companys global headquarters in Clinton, New York, U.S.  Jason Farrell has

Indium Corporation is pleased to announce that Brian OLeary has accepted a new role as Global Head of e-Mobility & Infrastructure in addition to his current position as Global