プレスリリース

Indium Corporation’s Meagan Sloan, Technical Support Engineer, will present on the importance of testing to ensure long-term reliability of flux residues during the SMTA New England

Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China. Yan’s

Indium Corporation will feature its proven Indium3.2HF Solder Paste for fine-pitch printing at SiP Conference China 2019, September 10-11, in Shenzhen, China. Indium

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Annual Conference,

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019), September 8-10, in Wuxi,

Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference, September 16-19,

Indium Corporation’s Jason Chou, Area Technical Manager – Taiwan, will present at SEMICON Taiwan 2019, September 18-20 in Taipei, Taiwan. Chou will present Challenges

Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei,

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in

Indium Corporation, in cooperation with industry partners MicroCare and Weller, will host a half-day, reliability-focused technical symposium at SMTA Atlanta on

Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston,

In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise

Indium Corporation will feature its Indium8.9HF Solder Paste at Productronica India, September 25-27, in Greater Noida, Delhi National Capital Region, India.  Indium8.9HF is

Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material that is

Indium Corporation will feature its ultra-reliable, void-reducing Indium8.9HF Solder Paste for automotive applications at SMTA International, September 22-26, Rosemont, Illinois,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise at the 20th International Conference on Electronic Packaging Technology (ICEPT

Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September

Indium Corporation will feature its “no-spatter” flux-cored wire, Core 230-RC, at SMTA International, September 22-26, in Rosemont, Illinois, USA. Indium Corporation’s

Indium Corporation will feature its ultra-reliable Indium8.9HF-1 Solder Paste at NEPCON Asia, August 28-30, in Shenzhen, China.  Indium Corporations Indium8.9HF-1 is

Indium Corporation will feature its proven Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28-30 in Taipei, Taiwan.  The use of