プレスリリース

Indium Corporation will feature its Indium8.9HF Solder Paste at the China High-End SMT Academic Conference, Oct. 23, Chengdu, China. Indium8.9HF is an industry-proven solder paste

In celebration of Indium Corporation’s 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise

Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in

Indium Corporation, Utica’s Technology Company®, will showcase a wide range of manufacturing careers with an interactive display at this year’s National Manufacturing

Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will host a 45-minute Thermal LIVETM webinar at 10:15 a.m., Oct. 22,

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the ITW EAE Smart Stencil Printing Solutions seminar, October

Indium Corporation will feature its proven solder solutions live on the show floor throughout SMTA International 2019 from Sept. 24-25 in Rosemont, Illinois, USA. Live@SMTAI is a joint

Indium Corporation President and Chief Operating Officer Ross Berntson will share his industry expertise and insight during the CEO Forum at Productronica India,

Indium Corporation will feature its proven suite of solder pastes for reliability at the Guadalajara Expo & Tech Forum, October 23-24 in Verde Valle, Guadalajara. Indium

In celebration of Indium Corporation’s 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the IMAPS Autumn Conference 2019, October 17-18, in Munich,

Indium Corporation’s Meagan Sloan, Technical Support Engineer, will present on the importance of testing to ensure long-term reliability of flux residues during the SMTA New England

Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China. Yan’s

Indium Corporation will feature its proven Indium3.2HF Solder Paste for fine-pitch printing at SiP Conference China 2019, September 10-11, in Shenzhen, China. Indium

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Annual Conference,

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Testing and Marketing Conference (CSPT 2019), September 8-10, in Wuxi,

Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference, September 16-19,

Indium Corporation’s Jason Chou, Area Technical Manager – Taiwan, will present at SEMICON Taiwan 2019, September 18-20 in Taipei, Taiwan. Chou will present Challenges

Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei,

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in