プレスリリース

October 30, 2015

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components. This brief video, which can be

October 29, 2015

Indium Corporation Celebrates Technology Manufacturing at SUNY Poly Manufacturing Day Expo

Indium Corporation celebrated National Manufacturing Day with more than 60 other exhibitors at the SUNY Poly Manufacturing Day Expo on Oct. 16 at SUNY Polytechnic University, Marcy,

October 28, 2015

インジウムコーポレーション、材料選択によるエレクトロニクス製造の生産性と収益性の向上について語る

Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity

October 27, 2015

Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF at Productronica

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.  Indium8.9HF is

October 22, 2015

Indium Corporation Discusses Advantages of Low-Temperature Solder Alloys, Indium-, and Bismuth-Based

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and

October 20, 2015

Indium Corporation’s Hisert Explains How to Select the Proper Solder Preform

Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform. This brief video features Indium

October 19, 2015

Indium Corporation’s Jensen on Achieving Uniform Solder Bondline Thickness

Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger

October 16, 2015

Indium Corporation’s Lasky Discusses Uptime and Productivity Improvement

Indium Corporation announces the release of its newest informational video that provides real-world examples of drastic improvements of electronics manufacturing uptime and productivity. This

October 15, 2015

Indium Corporation’s Jensen to Share Expertise on Improving Mechanical, Electrical, and Thermal Reliability of Electronics

Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on

October 14, 2015

Indium Corporation’s Heat-Spring Thermal Interface Material Enhances Device Performance

Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces. The

October 13, 2015

Indium Corporation’s Full Line of Inorganic Indium Compounds Offer Solutions for Numerous Products

Indium Corporation's full line of inorganic compounds addresses numerous applications and demands. The company's offerings include indium oxide, indium-tin oxide, indium trichloride,

October 12, 2015

Indium Corporation Experts Present at Two Events

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Seven Liang, Assistant Area Technical Manager – Southern China, presented at two separate events in China

October 9, 2015

Indium Corporation Announces New Tech Publication by SMT Expert Phil Zarrow

Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM

October 8, 2015

Indium Corporation Names McKenna as CFO

Indium Corporation, Utica's Technology Company®, has promoted Mike McKenna to the position of Vice President and Chief Financial Officer (CFO). As CFO, McKenna is responsible for leading and

October 1, 2015

Indium Corporation Technologists to Speak at IMAPS 2015

Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.

September 29, 2015

Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R

Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced

September 24, 2015

Indium Corporation Technology Expert to Present at SMTA Puget Sound Chapter

Indium Corporation’s Eric Bastow, Assistant Technical Manager, will present at a meeting of the Puget Sound Chapter of the SMTA on Oct. 27 in Seattle,

September 22, 2015

Indium Corporation’s Lim to Present at Microelectronics Tech Asia Singapore Conference

Indium Corporation's Sze Pei Lim, Technical Manager for Southeast Asia, will present at the Microelectronics Tech Asia Singapore Conference on Sept. 28-29 in Singapore. Lim’s

September 8, 2015

Indium Corporation’s Mikolajczak to Present at EU Critical Raw Materials Seminar

Indium Corporation's Claire Mikolajczak, Director, Metals & Chemicals, will share her expertise at the EU Critical Raw Materials: Essential for Your Business and Your Industry Now and in

September 4, 2015

Indium Corporation’s Director of Marketing Communications to Present at Content Marketing World 2015

Indium Corporation's Rick Short, Director of Marketing Communications, will speak at Content Marketing World 2015, Sept. 9, in Cleveland, Ohio. Short’s presentation, A

September 3, 2015

Indium Corporation’s Lasky to Present at Dallas SMTA Event

Indium Corporation's Dr. Ron Lasky, Senior Technologist, will share his expertise at the Dallas SMTA Technical Presentation and Luncheon, Sept. 18 in Carrollton, Texas. Dr. Lasky’s