プレスリリース

August 25, 2015

インジウムコーポレーションがIMAPS 2015でLED製造用ヒートスプリングを特集

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in

August 18, 2015

Indium Corporation Promotes Rivet, Humpf, Foster

Indium Corporation, Utica’s Technology Company®, has promoted three of the company’s information technology (IT) experts. Jeff Rivet has been promoted to Group Leader – Network

August 13, 2015

Indium Corporation’s Briggs to Present at Capital Expo & Tech Forum

Indium Corporation’s Ed Briggs, Senior Technical Support Engineer, will present at the SMTA Capital Expo & Tech Forum, Sept. 1, in Laurel,

August 13, 2015

Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China

Indium Corporation will feature its Indium8.9HF and Indium10.1 solder pastes at NEPCON South China 2015, on Aug. 25-27, in Shenzhen, China.  Pb-free,

August 11, 2015

Indium Corporation Adds to Rapidly-Growing SMTA-Certified Engineering Team

Indium Corporation announces that several company technologists have earned their designation as SMTA-Certified Process Engineers, further expanding the largest SMTA-certified engineering team

August 4, 2015

Indium Corporation Hires New Technical Support Engineer for Global Accounts Group

Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. The following six technical papers from

July 28, 2015

Indium Corporation Features Indium8.9HF Solder Paste at SMTAI

Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept.

July 21, 2015

Indium Corporation Asia-Pacific Operations Celebrates 20 Years

Indium Corporation is celebrating 20 years of service and supply from its Asia-Pacific operations to the global electronics, semiconductor, solar, thin-film, and thermal management markets.

July 21, 2015

Indium Corporation Promotes Anweiler, Manning; Hires Mannix

Indium Corporation, Utica’s Technology Company®, has strengthened its team with the promotions of Jeff Anweiler and Barb Manning, and the hiring of Steve Mannix. Anweiler has been promoted

July 16, 2015

Indium Corporation VP of Technology to Present at ICEPT 2015

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at ICEPT 2015, August 11-14 in Changsha, China.

July 14, 2015

Indium Corporation Expert to Present at EPE

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drives’s (EPE) 17th Conference

July 9, 2015

Indium Corporation’s 2015 Boilermaker Team Breaks Company Record

Twenty-five Indium Corporation employees will participate in the 2015 Boilermaker Road Race on Sunday, July 12 – the largest group in the company's

July 7, 2015

インジウム・コーポレーションがマーケティング・コミュニケーションのスペシャリストを採用

Indium Corporation, Utica's Technology Company®, has hired Colleen Bierstine as a Marketing Communications Specialist. Bierstine is based at corporate headquarters in Clinton and is

July 7, 2015

Indium Corporation Hires Technical Support and Applications Engineer

Indium Corporation has hired Adolfo Gastelum as Technical Support and Applications Engineer. Gastelum is based in Tijuana, Mexico, and is responsible for acquiring new business by providing

June 30, 2015

Indium Corporation Encourages Career Growth with Summer Internship Program

Indium Corporation, Utica's Technology Company®, announces the addition of 12 summer interns in various departments throughout their local

June 30, 2015

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015

June 25, 2015

Indium Corporation’s Patented BiAgX: A Drop-In Replacement for High-Pb Solders

Indium Corporation’s newly-patented BiAgX® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC

June 18, 2015

Indium Corporation and IMAPS Empire Chapter to Host “Advances in Semiconductor Packaging” Workshop in September

Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY),

June 16, 2015

Indium Corporation Expert to Present at IPC Shanghai Technology Seminar

Indium Corporation’s Aaron Yan, Area Technical Manager – Eastern China, will present at the IPC Shanghai Technology Seminar on July 17 in Shanghai, China. Yan’s

June 9, 2015

Indium Corporation Expert to Present at IPC Beijing Technology Seminar

Indium Corporation's Pony Liao, Area Technical Manager – Northern China, will present a technical paper at the IPC Beijing Technology Seminar on June 19 in Beijing, China.

May 27, 2015

Indium Corporation’s Samiappan Named Regional Manager for Northern California

Indium Corporation announces that Sehar Samiappan has been appointed Regional Manager for Northern California. In his new role, Samiappan will be responsible for growing Indium