Indium Corporation’s Joe Bahou, Technical Sales Support Engineer, West Coast, will present at SMTA San Diego’s Chapter Meeting on March 8 in Poway, Calif.
Bahou will present Minimizing Voiding in Bottom Terminating Components, which provides an introduction to QFN challenges, determining void criteria, design of experiments (DOE), results, void control using Solder Fortification®, and conclusions.
Bahou supports Indium Corporation’s advanced SMT materials, fluxes and engineered thermal materials to customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Bahou is based in Huntington Beach, Calif., and has more than 16 years of experience in electronics assembly manufacturing, including hands-on experience in SMT production. Bahou has a bachelor's degree in mechanical engineering from the University of Massachusetts Lowell. In addition, he has worked on the development of 01005 chip component placement onto a printed circuit board.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
