Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
Indalloy303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the solder joint beyond that of traditional low-temperature solders.
As a low-temperature, Pb-free solution, Indalloy303 offers:
- A reflow temperature as low as 170
- 優異的熱循環性能
- Resistance to hot tearing
- Compatibility with SAC in hybrid BGA joints
- 低排空
Indalloy303s flux vehicle, Indium5.7LT-1, is an air-reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-containing low-temperature alloys. It delivers:
- Superior print transfer efficiency
- Clear post-reflow flux residue
- Solder bead and solder ball minimization
- Exceptional wetting on OSP, Immersion Ag, Immersion Sn, and ENIG
- Excellent coalescence of small deposits
- Outstanding SIR performance under challenging low-temperature reflow conditions
For more information about Indium Corporations high-reliability alloy products, visit indiumstg.wpenginepowered.com/products/solders/solder-alloys/.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
