Indium Corporation has honored six of its employees for their industry contributions with its annual Silver Quill Award.
Indium Corporations Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to award employees for generating leading-edge research and thought-leadership technical content that addresses issues concerning customers in the electronics industry.
The following employees were honored with the 2021 Paper of the Year award:
Dr. HongWen Zhang, R&D manager alloy group, Samuel Lytwynec, technical support engineer, and research metallurgists Huaguang Wang, Dr. Jie Geng, and Francis Mutuku.
The paper, A Novel Mixed-Powder Low-Temperature Solder with Superior Drop Shock Resistance, was published and presented at APEX 2021 and focuses on a study which examines the strengths of Indium Corporations innovative low-temperature alloy system, Durafuse LT. In the study, Durafuse LT delivered superior drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup.
Special recognition was given to Chris Nash, senior product manager, PCBA, and Dr. Ron Lasky, senior technologist,who, with the support of Indium Corporations expert technical engineers, co-authored The Printed Circuit Assemblers Guide to Solder Defects, an e-book published by I-Connect007. The book addresses six common defect topics and how to avoid them in order to help PCB assemblers improve their assembly processes and the reliability of the end-product, eliminate field failures, and reduce costs.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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