Indium Corporation has honored six of its employees for their industry contributions with its annual Silver Quill Award.
Indium Corporations Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to award employees for generating leading-edge research and thought-leadership technical content that addresses issues concerning customers in the electronics industry.
The following employees were honored with the 2021 Paper of the Year award:
Dr. HongWen Zhang, R&D manager alloy group, Samuel Lytwynec, technical support engineer, and research metallurgists Huaguang Wang, Dr. Jie Geng, and Francis Mutuku.
The paper, A Novel Mixed-Powder Low-Temperature Solder with Superior Drop Shock Resistance, was published and presented at APEX 2021 and focuses on a study which examines the strengths of Indium Corporations innovative low-temperature alloy system, Durafuse LT. In the study, Durafuse LT delivered superior drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup.
Special recognition was given to Chris Nash, senior product manager, PCBA, and Dr. Ron Lasky, senior technologist,who, with the support of Indium Corporations expert technical engineers, co-authored The Printed Circuit Assemblers Guide to Solder Defects, an e-book published by I-Connect007. The book addresses six common defect topics and how to avoid them in order to help PCB assemblers improve their assembly processes and the reliability of the end-product, eliminate field failures, and reduce costs.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
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