Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX Expo technical conference on February 27 in San Diego, Calif.
NPI 獎表揚在過去 12 個月內領先的電子組裝新產品。獲獎者由執業工程師組成的獨立評審團選出。
"Developing Core 230-RC and having the electronics assembly industry recognize it as a leading new product, is truly a great honor," said Tim Twining, Vice President, Marketing. "I am very proud of our team and the work they have done to develop and deliver this high-performance product to our customers."
Indium Corporation's Core 230-RC is a new REACH- and RoHS-compliant, J-STD-004B tested and compliant "no-spatter" formula cored wire.
"In 2017, Indium Corporation sold more than 932 miles (1,500 kilometers) of 0.2 mm diameter flux-cored wire on 114-gram level wound spools," said Eric Slezak, Director of Business Development and Printed Circuit Board Assembly. "Indium Corporation is the only company that can put ¼ lb. of 0.2 mm cored wire on a level wound spool in volume and ensure no tangling or feeding issues. This enables a more efficient and lengthy robotic soldering process."
Core 230-RC delivers an exceptionally impressive 0.09% total flux spatter, as tested per IPC TM-650 2.4.48. "No-spatter" is important so that flux does not contaminate gold fingers or other contacts where it can interfere with circuit board electrical properties, or spatter hot flux on operators' hands. It is available in lead-free, tin-lead, and high-lead cored wires. In lead-free cored wire the available diameters are from 0.008" (0.2mm) up to 0.125" and flux weight content from 1.0% to 4.5%.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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