Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 6 a.m. BST and again at 11 a.m. on Tuesday, June 23.
Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. An uneven bondline can result in early cracking and solder layer delamination due to stress concentration at the thinner joint areas. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Vijay will examine how InFORMS®, a reinforced matrix solder composite preform (and patent-pending ribbon), deliver uniform bondline control and enhanced reliability by a factor of 2X while achieving the lowest cost of ownership. A live question and answer session will follow the presentation.
Indium Corporation's InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform.
To register for Vijay's webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to ensure Indium Corporation's security measures don't filter messages into spam folders. This is a first-come, first-served event.
維傑負責歐洲、非洲及中東地區客戶的技術專案與技術支援。此前他駐點於加州聖荷西，負責北美西岸客戶的應用支援工作。其專業領域涵蓋汽車、工業及射頻應用領域，涉及印刷電路板組裝（PCBA）與電力電子技術，尤其專精於多種材料組合的應用，包括焊料預成型件、焊膏、熱介面材料及半導體級電子材料。
He joined Indium Corporation in 2003 and has more than 20 years of experience in electronics assembly. Vijay has a master's degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College's Thayer School of Engineering. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
