Indium Corporation's Adam Murling, Technical Support Engineer, will participate in an SMTA Wisconsin SMT Printing Roundtable Discussion webinar on Tuesday, June 2 at 3:30 p.m. CDT.
The webinar is designed to be an open discussion about SMT printing challenges in the industry and will start with a Printing 101—the basics of SMT printing. Topics covered will include insufficient solders, excessing solders, high tension stencils, nanocoating (life), paste size and pin-in-paste.
The webinar is free to SMTA members and is $25 for non-members. Reserve your attendance by Friday, May 29. The webinar link will be sent to those who pre-register for the event here. Attendees are encouraged to submit questions to [email protected].
If you're looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.
Murling is responsible for providing leading-edge technical support for customers around the globe through SMT process optimization, material recommendations, and customer training. He nurtures existing accounts and assists in strategy development for obtaining new accounts. Murling also plans and executes customer and internal designs-of-experiments. He is a Certified SMT Process Engineer, an active blogger, and has authored technical papers on wave solder fluxes and solder preforms. Murling has a bachelor's degree in chemical engineering and a master's degree in engineering management from Clarkson University.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
