Indium Corporation's Adam Murling, Technical Support Engineer, will participate in an SMTA Wisconsin SMT Printing Roundtable Discussion webinar on Tuesday, June 2 at 3:30 p.m. CDT.
The webinar is designed to be an open discussion about SMT printing challenges in the industry and will start with a Printing 101—the basics of SMT printing. Topics covered will include insufficient solders, excessing solders, high tension stencils, nanocoating (life), paste size and pin-in-paste.
The webinar is free to SMTA members and is $25 for non-members. Reserve your attendance by Friday, May 29. The webinar link will be sent to those who pre-register for the event here. Attendees are encouraged to submit questions to [email protected].
If you're looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.
Murling is responsible for providing leading-edge technical support for customers around the globe through SMT process optimization, material recommendations, and customer training. He nurtures existing accounts and assists in strategy development for obtaining new accounts. Murling also plans and executes customer and internal designs-of-experiments. He is a Certified SMT Process Engineer, an active blogger, and has authored technical papers on wave solder fluxes and solder preforms. Murling has a bachelor's degree in chemical engineering and a master's degree in engineering management from Clarkson University.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
