Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California.
Lim will present Soldering Material Challenges for Heterogeneous Integration and Assembly, which examines heterogeneous integration as the industry’s solution to overcoming miniaturization needs—such as increased functionality, lower power consumption, lower cost, and faster time to market. Heterogeneous integration provides enhanced functionality and improved operating characteristics in the package. As this integration becomes more extensive and the assembly process becomes more complicated, different types of soldering alloys and fluxes are often needed to meet the processing and reliability requirements.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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